Technology R & D：
1. Magnetic powder glue, low swelling coefficient epoxy glue for NR power inductors;
2. Glass bead epoxy adhesives with different GAP heights for high current inductor devices;
3. One-component epoxy resin with low expansion coefficient and high temperature resistance for potting filter components of high current vehicle system;
4. Low expansion coefficient, one-component high-density epoxy resin for potting IC device products;
5. Whisperer Ceramic Sheet Bonded to Metal High Temperature Resistant, No Filler Resin;
6. Different colors of UV glue for winding inductors;
7. Precision motor, A/B structural adhesive for fans, balance soil;
8. High temperature resistance (reflow soldering possible), high weather resistance, three anti-adhesives with different curing processes;