1.2 The air path of the component suction nozzle is blocked, the suction nozzle is damaged, and the suction nozzle height is incorrect.

1.3 The vacuum circuit of the equipment is faulty and blocked.

1.4The circuit board is poorly stocked and deformed.

1.5There is no solder paste or too little solder paste on the pads of the board.

1.6Component quality problem, the thickness of the same variety is inconsistent.

1.7 There is an error in the calling program of the placement machine, or the selection of the component thickness parameter is wrong during programming.

1.8 Accidentally touched by human factors。

The main factors that lead to the flipping and side parts of SMC resistors when patching

2.1The feeding of the component feeder is abnormal。

2.2 The nozzle height of the placement head is incorrect。

2.3The height of the placement head is not correct。

2.4 The size of the charging hole of the component tape is too large, and the component is turned over due to vibration。

2.5 The direction of the bulk material when placed in the braid is reversed.

3.2The reason of the patch nozzle makes the suction unstable。

4.2 When programming the placement machine, the Z-axis coordinates of the components are incorrect.

4.3The nozzle spring of the placement head is stuck.