Epoxy Potting Compound Overview

Epoxy encapsulant refers to a type of electronic encapsulant made of epoxy resin, including one-component epoxy encapsulant and two-component epoxy encapsulant. Epoxy potting compounds are generally hard and rigid, but there are also soft and even elastic ones. Ordinary epoxy potting glue is characterized by strong adhesion, high confidentiality, low price and easy use.

There are many types of epoxy potting compounds. Different types of epoxy potting compounds have great differences in temperature resistance, waterproof performance, insulation performance, optical performance, adhesion and adhesion to different materials, and softness and hardness. Epoxy encapsulant can be added with some functional fillers to give it properties such as electrical conductivity, thermal conductivity, and magnetic conductivity. The color of epoxy encapsulant can generally be adjusted arbitrarily according to needs. Either transparent or non-transparent or colored.

How to use epoxy resin encapsulant

The two-group epoxy potting compound is the most common. Before use, the two components A and B are evenly mixed and used. Usually, component A is a rubber compound (which contains reinforcing additives and various functional fillers, etc.), and component B is a curing agent. Two-component epoxy encapsulant can generally be cured at room temperature, or can be cured quickly by heating, and is used to encapsulate electrical modules and diodes. The use of two-component potting glue is basically the same, generally: ingredients--mixing--vacuum--potting--standing--check storage. Two-component potting equipment can be used to simplify the entire operation process, while saving operation time and reducing waste of raw materials.

Some two-component epoxy potting adhesives have high viscosity. Generally, adding appropriate reactive diluents or adding components A and B

respectively (heating will greatly reduce the viscosity of the rubber compound) and then mixing and potting.

One-component epoxy encapsulant generally requires high temperature curing, some varieties require curing at a point of 80 degrees Celsius, and some require more than 150 degrees Celsius to cure. Generally, the lower the curing temperature, the shorter the shelf life of the one-component epoxy potting compound at room temperature, and vice versa. Therefore, some epoxy potting compounds are even required to be stored in a low-temperature refrigerator.

Features of epoxy resin encapsulant

1. Environmental protection and no pollution: it can be dissolved at a lower temperature and has uniform fluidity;

2. High dielectric strength, good insulation performance, reduce the working temperature of the original device, thereby prolonging the service life of the product;

3. It has good thermal conductivity and heat dissipation, high temperature and low temperature resistance, and excellent thermal stability, so the sensitivity to high temperature is greatly reduced;

4. Prevent aging: The product is not easy to age after potting and curing, and avoids the phenomenon that other similar products are easy to age and crack;

5. Good sealing: Its excellent sealing can reduce vibration and noise of electronic products;

6. Waterproof, moisture-proof and moisture-proof: The electronic components after coating or potting have excellent moisture-proof, waterproof, dust-proof, anti-corrosion, ozone resistance, weather resistance and other effects;

7. The potting temperature is low and will not damage the components with heat resistance above 85℃-105℃;

8. Curing at room temperature: After potting, it can be cured at room temperature in a short time, and the heat dissipation speed is fast;

9. Simple filling and sealing process: manual or glue filling machine can be used for filling and sealing, assembly line operation, convenient operation and improved production efficiency.

Curing mechanism of epoxy resin encapsulant

The molecular structure of epoxy resins is characterized by the presence of active epoxy groups in the molecular chain, which can undergo cross-linking reactions with various types of curing agents to form polymers with a three-way network structure. The cured epoxy resin has good physical and chemical properties, excellent adhesive properties, small deformation shrinkage, good stability and high hardness, so it is widely used in construction, roads and other fields.

Storage of epoxy encapsulant

1. It must be stored in a dry, ventilated, low-temperature place, away from a place where open flames may occur. The temperature is best maintained at 10-30 degrees at room temperature. Higher humidity requirements can effectively reduce its flammability, generally maintained at more than 50%, not higher than 80%, otherwise it will affect its use effect. When storing in the warehouse, pay attention to prevent paint leakage caused by rust.

2. The resin that is not used up after the opening should be placed in a ventilated and safe place, and pay attention to slightly sealing the opening. Paints that are unified into openings should be treated with external protection, such as masking with wood products or unified packaging with boxes. Epoxy resin is flammable and explosive, and its volatilized vapor is harmful to human body and the environment. Therefore, it is necessary to strengthen the management in storage and storage, and formulate safety measures in the process of storage, transportation and preparation.