Epoxy Thermally Conductive Potting Compound

Epoxy potting glue refers to a type of epoxy resin liquid encapsulation or potting material made of epoxy resin as the main component, adding various functional additives, and cooperating with suitable curing agent. The most common one is two-component, and there are also one-component heating curing. The main agent and curing agent of the two-component potting glue are separately packaged and stored. Before use, the AB mixing ratio must be carried out according to a specific ratio. After stirring evenly, the potting operation can be carried out. The colloid was vacuumed and deaerated before. Two-component is also divided into medium and high temperature curing type and normal temperature curing type due to different curing agents, and there are other special curing methods.

There are several varieties of thermally conductive potting epoxy adhesives, including ordinary thermal conductivity, high thermal conductivity, high temperature resistance, etc. Different thermally conductive potting epoxy adhesives have great differences in adhesion to different cavities. The thermal conductivity is also very different, and generally manufacturers can customize it according to their needs.

Epoxy potting glue: mostly hard, and a small part of soft. The biggest advantage is that it has good adhesion to hard materials, cannot be opened after potting, high hardness, good insulation performance, ordinary temperature resistance is 100 degrees, and heating curing temperature resistance is about 150 degrees. Repairability is not good.

Polyurethane thermally conductive potting compound

Polyurethane thermally conductive potting compound is also known as PU thermally conductive potting compound. The main components are polybenzyl diisocyanate and polyether polyol which are cross-linked and cured in the presence of a catalyst (triethylene diamine) to form a polymer. Polyurethane adhesive has a relatively high performance. Good bonding performance, insulation performance and good weather resistance, hardness can be changed by adjusting the content of diisocyanate and polyether polyol, which can be applied to the packaging of various electronic and electrical equipment.

Polyurethane encapsulant: The adhesiveness is between epoxy and silicone, and the high temperature resistance is average, generally not more than 100 degrees, and there are many bubbles. It must be vacuum poured. The advantage is good low temperature resistance. Polyurethane potting compound has excellent electrical insulation, especially suitable for the sealing of electronic circuit boards and components used in harsh environments (such as humidity, vibration and corrosive places), such as washing machine control panels, pulse igniters, electric bicycles drive controller, etc. Polyurethane encapsulant overcomes the disadvantages of brittle epoxy resin and low strength and poor adhesion of silicone resin, and has excellent water resistance, heat resistance, cold resistance, ultraviolet resistance, acid and alkali resistance, high and low temperature impact resistance, Moisture-proof, environmentally friendly and cost-effective, it is an ideal potting protection material for electronic components. Comprehensively meet V0 flame retardant grade (UL), environmental certification (RoHS) and other certifications. Especially for the problem of lithium-ion battery leakage, polyurethane potting compound shows strong resistance to electrolyte corrosion.